Training Description

This 3-day training course provides industry, especially those involved in PIC-based product development, with the basic technical skills in ideating, designing, fabricating, and testing SiPh PICs. The course covers various forms of SiPh such as thin SOI, thick SOI, LPCVD SiN, PECVD SiN, and Ge- on-Si along with the deployment of these technologies into application domains such as communications, medical, sensors, quantum, environmental, computing, etc.

European Silicon Photonics Experience Center Training (Edition 3)

May 10-12, 2023
Registration

Supported by PhotonHub Europe

Training Organizers

The training will be organized by ePIXfab (hosted by UGent) with the support of its members:

The support provided by ePIXfab members will make the course cohesive and inclusive to all forms and brands of SiPh technologies – making the training unique in the European landscape.

Training Scope

Hands-on training with respect to:

  • determining the right SiPh technology platform & design environment for a given application
  • designing a SiPh chip and associated key fabrication steps
  • developing test-beds and testing of SiPh PICs for various applications.

Expected Outomes

  • Mastery in choosing the appropriate technology platform for a use case

  • Mastery in adopting the right design framework for a use case

  • Understanding of challenges associated with the fabrication of SiPh chip

  • Experience in different testing schemes and fiber-chip-fiber coupling schemes

  • Experience in on-chip optoelectronic testing, including high-speed testing

Practical Details

Training Capacity

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10 persons
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Training Place

iGent Tower
Ghent
Belgium (map)

Training Cost

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900 Euro
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[For participants of the previous editions] Please login to get access to the training material

Content

Day 1: 16.08.2022

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Day 2: 17.08.2022

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Day 3: 18.08.2022

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