Test, Packaging and Assembly

Test services determine the performance of a fabricated silicon photonic IC. These services can handle the testing on wafer-scale or on die-scale. The testing service can include optical, optoelectronic, and electro-optic testing.

The packaging and assembly services provide electrical and optical IO to the chip. The packaging and assembly services handle the thermal, electrical, mechanical and optical issues. The packaging service use standardised electro-opto-mechanical designs which reduces costs and speeds up development and assembly times. Based on the requirements, customize packaging services are also available.