This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. The webinar also addresses the assembly of fiber arrays and spot-size converters, creation of robust optical interfaces, and approaches to thermal packaging. Attendees will gain a clear understanding of the full photonic assembly workflow and the process controls that enable high-quality, repeatable results.
This webinar is the second of three webinars about packaging technologies for photonics. You can find the third webinar in our upcoming events page.
Andrea Alippi is product manager at PHIX Photonics Assembly. Driving the company's portfolio for standard and custom packaging solutions within a broad application range. Expert in early engagement with customers, foundries and other photonic stakeholders addressing PIC and product designs providing guidance toward a design for manufacturing. High focus on PIC packaging technologies like Fiber/Chip-To-Chip and Die/Wire bonding addressing the major PIC technologies as SiPh, SiN, InP, TFLN.PHIX is a globally recognized foundry specializing in the packaging and assembly of PICs and MEMS devices.