Detailed Program of the Symposium

All talks by European speakers will be live-streamed to the symposium venue and will be accessible for the online participants via live streaming

The full program is available for Download (Symposium Program)

Note: There may be small changes in the program.


China Standard
Time

Central European
Time

Speaker name, affiliation and abstract of the talk


09:00 am

1:00 pm

Welcome by Prof. Roel Baets (Chair of ePIXfab) and Dr. Jianzhong Han (CEO, CUMEC)

Prof. Roel Baets and Dr. Jianzhong Han will welcome the symposium participants.

09:30 am

1:30 pm

Keynote talk by Dr. Jin Guo, Vice President , Chongqing United Microelectronics Center (China)

Will be announced shortly

10:10 am

2:10 pm

Special Announcement by CUMEC – PDK Launch

CUMEC will make a formal announcement related to the launch of its PDK. A lucky winner from the participants will get a special rate to participate in the first silicon photonics MPW run of CUMEC.

10:20 am

2:20 pm

Break with Promotional videos of the sponsors

Participants can get a chance to talk 1-on-1 with the representatives of the sponsoring companies. A special break-out session can be arranged on request by the participants.

10:40 am

2:40 pm

Keynote talk by Dr. Wei-Ping Huang, Chief Scientist,  HiSense Group (China)

Abstract will be provided shortly.

11:20 am

3:20 pm

Keynote talk by Dr. Xi Xiao, CEO, National Information Optoelectronics Innovation Center (China)

Abstract will be provided shortly.

12:00 pm

4:00 pm

Break with Promotional videos of the sponsors

Participants can get a chance to talk 1-on-1 with the representatives of the sponsoring companies. A special break-out session can be arranged on request by the participants.

Break  at 12:15 pm China Standard Time

Welcome to the European Participants  at 7:00 am Central European Time

1:15 pm

7:15 am

Break with Promotional videos of the sponsors

Participants can get a chance to talk 1-on-1 with the representatives of the sponsoring companies. A special break-out session can be arranged on request by the participants.

1:30 pm

7:30 am

Keynote talk by Dr. Steve Beckers,  Vice President, imec (Belgium)

From smart ideas to smart products

Over the 7 last years, a new wave of hardware innovation is shaping the semiconductor landscape. The cost of using Application Specific Integrated Circuits (ASICs), in a given semiconductor technology node, has been reducing over time. Today we experience a revival in the use of ASIC technology.

Next to standard CMOS technologies, and the More-than-Moore technologies, new innovative silicon technologies emerged, such as SiPhotonics and SiN.

Today’s presentation will address these changes in the semiconductor landscape and illustrate the way imec supports you. Imec is providing low barrier MPW access to cutting-edge technologies, to enable you to build your smart products.

2:10 pm

8:10 am

Keynote talk by Prof. Jose Capmany, Founder, iPronics & Polytechnic University of Valencia (Spain)

Programmable Photonics

Programmable Photonics  aims at designing common integrated optical hardware resource configurations, capable of implementing an unconstrained variety of functionalities by suitable programming following a parallel but not identical path to that of integrated electronics. It is raising a considerable interest, driven by the surge of a large number of new applications in the fields of telecommunications, quantum information processing, sensing and neurophotonics, which  call for flexible, reconfigurable, low-cost, compact and low-power-consuming devices that can cooperate with integrated electronic devices to overcome the limitation expected by the demise of Moore’s Law. Integrated photonic devices exploiting full programmability are expected to scale from application specific photonic chips (featuring a relatively low number of functionalities) up to very complex application-agnostic complex subsystems much in the same way as Field Programmable Gate Arrays and microprocessors operate in electronics. Two main differences need to be considered. First, as opposed to integrated electronics, programmable integrated photonics will carry analog operations over the signals to be processed. In second place, the scale of integration density will be several orders of magnitude smaller due to the physical limitations imposed by the wavelength ratio of electrons and lightwave photons.  In this talk I will  review the basic foundations and principles behind  programmable photonics,  review some practical aspects that limit the programming and scalability of programmable circuits and give an overview of some of the most salient applications demonstrated so far.

2:50 pm

8:50 am

Break with Promotional videos of the sponsors

Participants can get a chance to talk 1-on-1 with the representatives of the sponsoring companies. Special break-out session can be arranged on request by the participants.

3:20 pm

9:20 am

Special Announcement by CUMEC – PDK Launch

CUMEC will make a formal announcement related to the launch of its PDK. A lucky winner from the participants will get a special rate to participate in the first silicon photonics MPW run of CUMEC.

3:30 pm

9:30 am

Keynote talk by Prof. Peter O’ Brien, Director PIXAPP & Tyndall National Institute (Ireland)

Packaging & Integration Challenges for Photonic Integrated Circuits – from Research to Manufacturing

Photonic Integrated Circuits (PICs) combine multiple optical and electronic functions onto a single semiconductor chip, shrinking footprint and cost significantly. PIC technologies enable new applications such as faster and more portable communication devices, quantum computing, smart and minimally invasive surgical devices, personal medical diagnostics, food quality monitoring, autonomous vehicles, space-based systems, the internet-of-things and augmented reality systems. There have been significant developments to realise cost-effective PIC chip fabrication processes, but there now exists a manufacturing bottleneck associated with device packaging which is impeding the growth of these emerging markets. This talk will give an overview of photonic and electronic packaging technologies, and how these technologies are now being brought to commercialisation through a large-scale Pilot Line funded by the European Commission. Called PIXAPP, the Pilot Line provides users with a wide range of advanced photonic and electronic packaging technologies, with the ability to scale manufacturing to medium volumes. PIXAPP is strongly focused on offering standardised packaging technologies, and is working with its global partners to establish a detailed set of packaging design rules and technology roadmap. The talk will also discuss new research activities to develop a more scalable packaging technology for mass markets, taking lessons from the electronics industry to build a new global standard in PIC packaging.

4:10 pm

10:10 am

Keynote talk by Prof. Roel Baets, Chair of ePIXfab, Professor at Ghent University – imec (Belgium)

Wafer-scale Light Source Integration with Silicon Photonics

One of the great challenges in the field of silicon photonics is the wafer-scale integration of light sources. In essence the challenge is to integrate III-V semiconductors on to a silicon photonics platform. In this presentation I will discuss progress in this field, covering approaches from flip-chip and micro-optic benches via techniques based on bonding or transfer printing to truly monolithic approaches based on epitaxy.

4:50 pm

10:50 am

Announcement of the 2021 China-Europe Silicon Photonics Course and Symposium

Date and venue for the 3rd China-Europe Silicon Photonics Course and Symposium, to be held in 2021, will be announced

5:00 pm

11:00 am

Concluding Remarks

5: 15 pm

11:15 am

The event finishes with an announcement of the lucky winners (followed by delayed streaming for the EU participants for the first session)