Project Description

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About Tyndall National Institute – PIXAPP

PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, provides companies with standardized packaging solutions for prototyping and pilot-scale production.  PIXAPP offers a comprehensive building block menu to its customers including optical coupling, electrical interconnects, mechanical assembly, and thermal stabilization.

Expertise

PIXAPP Prototype Packaging Platform for Grating Coupler PICs

Below is an example of one of PIXAPP’s new standardised package designs that are ideal for early stage prototyping of photonic devices:

  • Low-Cost “Off the Shelf” Solution
  • Suitable for PICs with Grating Coupler I/Os
  • Dual Fibre Array Coupling
  • Supports 1-20 Channel Fibre-Arrays
  • Supports SMF and PMF Fibre-Arrays
  • Standardised PCB Available
  • 1-100 DC Electrical Connections
  • Integrated Thermistor and TEC

PIXAPP Prototype Packaging Platform for Edge Coupler PICs

Below is an example of one of our new standardised package designs that are ideal for early stage prototyping of photonic devices:

  • Low-Cost “Off the Shelf” Solution
  • Suitable for PICs with Edge Coupler I/Os
  • Single Fibre Array Coupling
  • Supports 1-20 Channel Fibre-Arrays
  • Supports SMF and PMF Fibre-Arrays
  • 1-100 DC Electrical Connections on Custom PCB
  • Integrated Thermistor and TEC

Read more about Tyndall National Institute – PIXAPP
Contact experts at PIXAPP