Detailed Program of the Course
The full program of the course: Download (Course-Program)
Day 1: 28 May 2020
|13:30 – 15:00||Welcome & Fundamentals of Silicon Photonics by Prof. Roel Baets, Ghent Univeristy – imec (Belgium)|
In this introductory lecture I will describe some of the basic aspects of silicon photonics (rationale, key building blocks, coupling to fiber, fabrication challenges…). That will be followed by key challenges for the future and a short overview of key application areas.
|15:30 – 17:30||Modulators and detectors in silicon photonics by Dr. Laurent Vivien C2N, CNRS, Univ. Paris-Sud, Univ. Paris Saclay (France)|
|18:30 – 20:00||Hybrid Integration in Silicon Photonics by Giovanni Delrosso, VTT, Technical Research Centre of Finland, Espoo, Finland|
In this session, heterogeneous integration of active devices on silicon-on-insulator (SOI) platform as well as other hybrid techniques such as flip-chip bonding and micro-transfer printing are presented.
Outstanding papers from different authors and affiliations in addition to recent achievements in SOI hybrid integration obtained at VTT are reviewed with the aim to provide a wider overview of active devices integration in Silicon Photonics.
15:00-15:30: Tea Break
17:30-18:30: Dinner Break
Day 2: 29 May 2020
|09:00 – 10:00||The progress of the Optical Phased Array for Lidar application, Li Jin, Project manager, CUMEC (China)|
|10:30 – 11:30||Photonic AI: The State of Arts and the future trends, Ye Tian, Project manager, CUMEC (China)|
|11:30 – 12:00||The package service of silicon photonics in CUMEC, Heng Zhao, Project manager, CUMEC (China)|
|13:00 – 14:00||Design challenges of hybrid integrated photonic and optoelectronic circuit by Dr. Andre Richter, VPI Photonics (Germany)|
Hybrid integrated photonics attracts significant attention, as it enables complete and cost-efficient optical chip solutions for silicon, silicon nitride, and polymer photonics in combination with III-V active optoelectronic devices.
We discuss by means of practical examples design challenges of hybrid PICs. Further, we present a workflow addressing these challenges that relies on standard simulation compact models (as part of foundry-specific photonic Process Design Kits) and a layout-aware design approach. We demonstrate flexible optoelectronic circuit simulation, analysis and optimization, as well as performance verification on application-specific system-level.
|14:00 – 15:00||Design Automation for Silicon Photonics by Dr. Martin Fiers, Luceda Photonics (Belgium)|
|15:30 – 16:30||Integrated Microwave Photonics by Prof. Jose Capmany, Polytechnic University of Valencia (Spain)|
|16:30 – 17:30||Integrated Photonics Sensors by dr. Yanlu Li, Ghent University – imec (Belgium) and dr. Thijs Spuessens, Sentea (Belgium)|
Silicon photonics holds an enormous potential for cost-effective and highly miniaturized sensors for many different applications (industrial, environmental, life science, automotive, civil…). After a short introduction that links the demand to the needed technological development, the focus of this lecture will mostly be on two application cases: personal health monitoring and structural health monitoring. Dr. Yanlu Li will describe the results of the EU-funded project CARDIS in which a silicon photonics based device for cardiovascular monitoring was developed. Dr. Thijs Spuessens of Sentea will describe the potential of silicon photonics in readout units for fiber Bragg gratings for structural health monitoring of wind mill blades, bridges, and other civil/mechanical constructions.
|18:30 – 19:15||Packaging Solutions for Silicon Photonics ICs by Dr. Padraic Morrissey, PIXAPP (Ireland)|
|19:15 – 20:00||European Open Access Silicon Photonics Platforms and Services by Dr. Abdul Rahim, ePIXfab – Ghent University (Belgium)|
10:00-10:30: Tea Break
12:00-13:30: Lunch Break
15:00-15:30: Tea Break
17:30-18:00: Dinner Break